Next-Generation Lead-Free Solder Plating Products for High Speed Bumping, Capping and Micro-Capping Applications

Jonathan Prange; Julia Woertink; Yi Qin; Pedro Lopez Montesinos; Inho Lee; Yil-Hak Lee; Masaaki Imanari; Jianwei Dong; Jeffrey Calvert

doi:10.4071/isom-2013-WA16

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Prange, Jonathan, Julia Woertink, Yi Qin, Pedro Lopez Montesinos, Inho Lee, Yil-Hak Lee, Masaaki Imanari, Jianwei Dong, and Jeffrey Calvert. 2013. “Next-Generation Lead-Free Solder Plating Products for High Speed Bumping, Capping and Micro-Capping Applications.” IMAPSource Proceedings 2013 (1): 458–60. https://doi.org/10.4071/isom-2013-WA16.

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