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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Thermomechanical Design for Fine Pitch 3D-IC Packages
Akihiro Horibe
,
Sayuri Kohara
,
Kuniaki Sueoka
,
Keiji Matsumoto
,
Yasumitsu Orii
,
Fumiaki Yamada
,
3D-IC
TSV
underfill
thermomechanical stress
FEA
organic laminate
IMC
•
https://doi.org/10.4071/isom-2012-WP66
IMAPSource Conference Papers
Horibe, Akihiro, Sayuri Kohara, Kuniaki Sueoka, Keiji Matsumoto, Yasumitsu Orii, and Fumiaki Yamada. 2012. “Thermomechanical Design for Fine Pitch 3D-IC Packages.”
IMAPSource Proceedings
2012 (1): 1001–9.
https://doi.org/10.4071/isom-2012-WP66
.
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