Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application

Frank Fan Wang, William McKeague, Christina Polwarth,
Sn62 versus Sn96 aerospace electronics thermal fatigue hybrid thick film and ceramic substrate satellite and space electronics
• https://doi.org/10.4071/2380-4505-2018.1.000596
IMAPSource Conference Papers
Wang, Frank Fan, William McKeague, and Christina Polwarth. 2018. “Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application.” IMAPSource Proceedings 2018 (1): 596–601. https://doi.org/10.4071/2380-4505-2018.1.000596.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system