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ISSN 2380-4505
Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application

Frank Fan Wang, William McKeague, Christina Polwarth,
Sn62 versus Sn96aerospace electronicsthermal fatiguehybrid thick film and ceramic substratesatellite and space electronics
https://doi.org/10.4071/2380-4505-2018.1.000596
IMAPSource Conference Papers
Wang, Frank Fan, William McKeague, and Christina Polwarth. 2018. “Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application.” IMAPSource Proceedings 2018 (1): 596–601. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000596.

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