Study of Void Formation Mechanism in Electroplated SnAg Solder Bump

Koji Tatsumi; Akio Sakai; Syunsuke Kawai; Takuma Katase; Takashi Miyazawa; Masayuki Ishikawa

doi:10.4071/isom-2016-THP44

Tatsumi, Koji, Akio Sakai, Syunsuke Kawai, Takuma Katase, Takashi Miyazawa, and Masayuki Ishikawa. 2016. “Study of Void Formation Mechanism in Electroplated SnAg Solder Bump.” IMAPSource Proceedings 2016 (1): 638–43. https://doi.org/10.4071/isom-2016-THP44.

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