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ISSN 2380-4505
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Advanced Devices and Electronic Packaging for Harsh Environment

Aicha Elshabini, Fred Barlow, Sharmin Islam, Pin-Jen Wang,
Harsh EnvironmentPower ModuleReliability TestingWideband DevicesHigh Temperature Packaging
https://doi.org/10.4071/isom-2013-THP61
IMAPSource Conference Papers
Elshabini, Aicha, Fred Barlow, Sharmin Islam, and Pin-Jen Wang. 2013. “Advanced Devices and Electronic Packaging for Harsh Environment.” IMAPSource Proceedings 2013 (1): 937–50. https:/​/​doi.org/​10.4071/​isom-2013-THP61.

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