Electromigration Performance of Fine-Pitch Copper Pillar Interconnections

Syed, Ahmer, Christopher J. Berry, Karthikeyan Dhandapani, Patrick Thompson, and Seung-Hyun Chae. 2012. “Electromigration Performance of Fine-Pitch Copper Pillar Interconnections.” IMAPSource Proceedings 2012 (1): 1018–25. https://doi.org/10.4071/isom-2012-THP11.