ISSN 2380-4505
Miki, Shota, Takaharu Yamano, Sumihiro Ichikawa, Masaki Sanada, and Masato Tanaka. 2014. “Development of 3D System-in-Package with TSV Technology.” IMAPSource Proceedings 2014 (1): 612–17. https://doi.org/10.4071/isom-WP13.
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