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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Development of 3D System-in-Package with TSV Technology
Shota Miki
,
Takaharu Yamano
,
Sumihiro Ichikawa
,
Masaki Sanada
,
Masato Tanaka
,
3D-SiP
TSV
Die stacking
MEOL
Flip-chip bonding
Thermo-compression bonding
•
https://doi.org/10.4071/isom-WP13
IMAPSource Conference Papers
Miki, Shota, Takaharu Yamano, Sumihiro Ichikawa, Masaki Sanada, and Masato Tanaka. 2014. “Development of 3D System-in-Package with TSV Technology.”
IMAPSource Proceedings
2014 (1): 612–17.
https://doi.org/10.4071/isom-WP13
.
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