Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps

Kei Murayama; Taiji Sakai; Nobuaki Imaizumi; Mitsutoshi Higashi

doi:10.4071/isom-2011-THA3-Paper6

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Murayama, Kei, Taiji Sakai, Nobuaki Imaizumi, and Mitsutoshi Higashi. 2011. “Electro-Migration Behavior in Micro-Joints of Sn-57Bi Solder and Cu Post Bumps.” IMAPSource Proceedings 2011 (1): 997–1006. https://doi.org/10.4071/isom-2011-THA3-Paper6.

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