Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
Kenny, Stephen, Kai Matejat, Sven Lamprecht, and Olivier Mann. 2012. “Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging.” IMAPSource Proceedings 2012 (1): 729–34. https://doi.org/10.4071/isom-2012-WA63.