Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects
Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects
Miyairi, Ken, Masahiro Sunohara, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Robert Cuchet, Helene Feldis, et al. 2012. “Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects.” IMAPSource Proceedings 2012 (1): 984–90. https://doi.org/10.4071/isom-2012-WP63.