Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects

Ken Miyairi; Masahiro Sunohara; Jean Charbonnier; Myriam Assous; Jean-Philippe Bally; Robert Cuchet; Helene Feldis; Kei Murayama; Mitsuhiro Aizawa; Gilles Simon; Mitsutoshi Higashi

doi:10.4071/isom-2012-WP63

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Miyairi, Ken, Masahiro Sunohara, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Robert Cuchet, Helene Feldis, et al. 2012. “Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects.” IMAPSource Proceedings 2012 (1): 984–90. https://doi.org/10.4071/isom-2012-WP63.

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