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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects

Ken Miyairi, Masahiro Sunohara, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Robert Cuchet, Helene Feldis, Kei Murayama, Mitsuhiro Aizawa, Gilles Simon, Mitsutoshi Higashi,
Silicon Interposer TSV DC test Assembly Reliability test
• https://doi.org/10.4071/isom-2012-WP63
IMAPSource Conference Papers
Miyairi, Ken, Masahiro Sunohara, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Robert Cuchet, Helene Feldis, et al. 2012. “Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects.” IMAPSource Proceedings 2012 (1): 984–90. https://doi.org/10.4071/isom-2012-WP63.
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