Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints
Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints
Jung, Yong, and Jin Yu. 2010. “Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints.” IMAPSource Proceedings 2010 (1): 319–24. https://doi.org/10.4071/isom-2010-TP4-Paper6.