Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints

Yong Jung; Jin Yu

doi:10.4071/isom-2010-TP4-Paper6

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Jung, Yong, and Jin Yu. 2010. “Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints.” IMAPSource Proceedings 2010 (1): 319–24. https://doi.org/10.4071/isom-2010-TP4-Paper6.

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