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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints
Yong Jung
,
Jin Yu
,
Sn-3.5Ag solder joint
Electromigration
Kirkendall void
polarity effect
•
https://doi.org/10.4071/isom-2010-TP4-Paper6
IMAPSource Conference Papers
Jung, Yong, and Jin Yu. 2010. “Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder Joints.”
IMAPSource Proceedings
2010 (1): 319–24.
https://doi.org/10.4071/isom-2010-TP4-Paper6
.
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