Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects
Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects
WANG, Tao, Jian CAI, Qian WANG, Hao ZHANG, and Zheyao WANG. 2011. “Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects.” IMAPSource Proceedings 2011 (1): 33–43. https://doi.org/10.4071/isom-2011-TA1-Paper5.
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