The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding Technology

Kunmo Chu; Sunghee Lee; Changyoul Moon

doi:10.4071/isom-Poster9

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Chu, Kunmo, Sunghee Lee, and Changyoul Moon. 2014. “The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-Free Wafer Bonding Technology.” IMAPSource Proceedings 2014 (1): 593–97. https://doi.org/10.4071/isom-Poster9.

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