Droplet-on-demand Inkjet-filled Through-silicon Vias (TSVs) as a Pathway to Cost-efficient Chip Stacking

Sadie, Jacob, Niels Quack, Ming C. Wu, and Vivek Subramanian. 2013. “Droplet-on-Demand Inkjet-Filled Through-Silicon Vias (TSVs) as a Pathway to Cost-Efficient Chip Stacking.” IMAPSource Proceedings 2013 (1): 866–71. https://doi.org/10.4071/isom-2013-THP36.