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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried
Fen Chen
,
Ning-Cheng Lee
,
No-clean
flux
Surface Insulation Resistance (SIR)
SAC305
halogen-free
soldering
low standoff components
wet flux residue
•
https://doi.org/10.4071/isom-2015-WP41
IMAPSource Conference Papers
Chen, Fen, and Ning-Cheng Lee. 2015. “High Reliability No-Clean Solder Paste for Designs Where Flux Cannot Be Dried.”
IMAPSource Proceedings
2015 (1): 434–42.
https://doi.org/10.4071/isom-2015-WP41
.
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