ISSN 2380-4505
Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Organic Chip Scale Package (CSP) Development for Flip Chip Applications
Organic Chip Scale Package (CSP) Development for Flip Chip Applications
Yamada, Tomoyuki, Masahiro Fukui, Kenji Terada, Masaaki Harazono, Teruya Fujisaki, Charles Reynolds, Jean Audet, et al. 2013. “Organic Chip Scale Package (CSP) Development for Flip Chip Applications.” IMAPSource Proceedings 2013 (1): 538–45. https://doi.org/10.4071/isom-2013-WA44.