Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Transient liquid phase sintering materials (TLPS) vs. conventional solders for high temperature MLCC interconnects.
Transient liquid phase sintering materials (TLPS) vs. conventional solders for high temperature MLCC interconnects.
McConnell, John, J. Bultitude, L. Jones, and J. Qazi. 2016. “Transient Liquid Phase Sintering Materials (TLPS) vs. Conventional Solders for High Temperature MLCC Interconnects.” IMAPSource Proceedings 2016 (1): 624–29. https://doi.org/10.4071/isom-2016-THP42.