Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Chip Last Fan Out as an Alternative to Chip First
Scott Chen
,
Simon Wang
,
Coltrane Lee
,
Adren Hsieh
,
John Hunt
,
William Chen
,
Chip First
Chip Last
Fan Out
Wafer Level Package
•
https://doi.org/10.4071/isom-2015-WA33
IMAPSource Conference Papers
Chen, Scott, Simon Wang, Coltrane Lee, Adren Hsieh, John Hunt, and William Chen. 2015. “Chip Last Fan Out as an Alternative to Chip First.”
IMAPSource Proceedings
2015 (1): 245–50.
https://doi.org/10.4071/isom-2015-WA33
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats