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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Embedded Die Substrates for Power Applications
Bernd K Appelt
,
Bruce Su
,
Uno Yen
,
Kay Essig
,
Embedded die
Substrates
power applications
Cu pad
organic substrate
plated copper
•
https://doi.org/10.4071/isom-2012-THP44
IMAPSource Conference Papers
Appelt, Bernd K, Bruce Su, Uno Yen, and Kay Essig. 2012. “Embedded Die Substrates for Power Applications.”
IMAPSource Proceedings
2012 (1): 1143–48.
https://doi.org/10.4071/isom-2012-THP44
.
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