Vol. 2012, Issue 1, 2012January 01, 2012 EDT
3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging
3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging
Kostka, Darryl, and Antonio Ciccomancini Scogna. 2012. “3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging.” IMAPSource Proceedings 2012 (1): 1057–67. https://doi.org/10.4071/isom-2012-THP21.