Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards

Gary Gu; Jon Chadwick; Daniel Jin

doi:10.4071/isom-2013-TA22

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Gu, Gary, Jon Chadwick, and Daniel Jin. 2013. “Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards.” IMAPSource Proceedings 2013 (1): 39–44. https://doi.org/10.4071/isom-2013-TA22.

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