Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards
Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards
Gu, Gary, Jon Chadwick, and Daniel Jin. 2013. “Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards.” IMAPSource Proceedings 2013 (1): 39–44. https://doi.org/10.4071/isom-2013-TA22.