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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors

Elviz George, Michael Osterman, Michael Pecht, Richard Coyle,
dwell timethermal fatigueceramicchip resistortemperature cyclingSnAgCuSnCu
https://doi.org/10.4071/isom-2012-TA44
IMAPSource Conference Papers
George, Elviz, Michael Osterman, Michael Pecht, and Richard Coyle. 2012. “Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors.” IMAPSource Proceedings 2012 (1): 127–35. https:/​/​doi.org/​10.4071/​isom-2012-TA44.
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