Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors
Elviz George
,
Michael Osterman
,
Michael Pecht
,
Richard Coyle
,
dwell time
thermal fatigue
ceramic
chip resistor
temperature cycling
SnAgCu
SnCu
•
https://doi.org/10.4071/isom-2012-TA44
IMAPSource Conference Papers
George, Elviz, Michael Osterman, Michael Pecht, and Richard Coyle. 2012. “Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors.”
IMAPSource Proceedings
2012 (1): 127–35.
https://doi.org/10.4071/isom-2012-TA44
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats