Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

R. Beica, A. Ivankovic, T. Buisson, S. Kumar, J. Azemar,
Advanced packaging wafer level packaging fan-in fan-out TSV 3DIC embedded technologies flip chip forecast roadmaps
• https://doi.org/10.4071/isom-2015-TP11
IMAPSource Conference Papers
Beica, R., A. Ivankovic, T. Buisson, S. Kumar, and J. Azemar. 2015. “The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends.” IMAPSource Proceedings 2015 (1): 1–5. https://doi.org/10.4071/isom-2015-TP11.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system