Vol. 2011, Issue 1, 2011January 01, 2011 EDT
RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package Substrate
RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package Substrate
Lee, Woong-Sun, Sang-Joon Lim, Heung-Jae Shin, Jong-Tae Lee, Jung-Kwon Park, Qwan-Ho Chung, and Kwang-Yoo Byun. 2011. “RF Sensitivity of Multi Chip Package Development by Using Embedded Resistor in Package Substrate.” IMAPSource Proceedings 2011 (1): 887–90. https://doi.org/10.4071/isom-2011-THA1-Paper2.
Powered by Scholastica, the modern academic journal management system