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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
High Frequency Signal Propagation in Through Silicon Vias
Srinidhi Raghavan Narasimhan
,
A. Ege Engin
,
3D IC Technology
Through Silicon Vias
Electrical Modelling and Characterization
•
https://doi.org/10.4071/isom-2012-TP12
IMAPSource Conference Papers
Narasimhan, Srinidhi Raghavan, and A. Ege Engin. 2012. “High Frequency Signal Propagation in Through Silicon Vias.”
IMAPSource Proceedings
2012 (1): 239–43.
https://doi.org/10.4071/isom-2012-TP12
.
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