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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

E. Misra, T. Wassick, I. Melville, K. Tunga, D. Questad, C. Muzzy, J. Coffin, C. Carey, R. Mendelson,
Chip Package Interactions C4 Electromigration Far Back End of Line Process and Design Enhancements Lead-free Solder Bumps
• https://doi.org/10.4071/isom-2015-THP21
IMAPSource Conference Papers
Misra, E., T. Wassick, I. Melville, K. Tunga, D. Questad, C. Muzzy, J. Coffin, C. Carey, and R. Mendelson. 2015. “C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-Free C4 Products.” IMAPSource Proceedings 2015 (1): 787–92. https://doi.org/10.4071/isom-2015-THP21.
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