Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing
Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing
Liu, Xiao, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, and Baron Huang. 2016. “Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.” IMAPSource Proceedings 2016 (1): 469–74. https://doi.org/10.4071/isom-2016-THA42.