Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing

Xiao Liu; Qi Wu; Dongshun Bai; Trevor Stanley; Alvin Lee; Jay Su; Baron Huang

doi:10.4071/isom-2016-THA42

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Liu, Xiao, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, and Baron Huang. 2016. “Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.” IMAPSource Proceedings 2016 (1): 469–74. https://doi.org/10.4071/isom-2016-THA42.

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