Liu, Xiao, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, and Baron Huang. 2016. “Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.”
IMAPSource Proceedings 2016 (1): 469–74.
https://doi.org/10.4071/isom-2016-THA42.