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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing

Xiao Liu, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, Baron Huang,
Temporary wafer bondingmechanical debondlaser debondhigh temperature survivability
https://doi.org/10.4071/isom-2016-THA42
IMAPSource Conference Papers
Liu, Xiao, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, and Baron Huang. 2016. “Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.” IMAPSource Proceedings 2016 (1): 469–74. https:/​/​doi.org/​10.4071/​isom-2016-THA42.
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