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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Laser Patterning and Via Drilling of Sapphire Wafers and Die
Justin Vignes
,
Fred Haring
,
Syed Sajid Ahmad
,
Kaycie Gerstner
,
Aaron Reinholz
,
Laser micromachining
sapphire
through-via
embedded device or circuitry
3D packaging
stacked die
•
https://doi.org/10.4071/isom-2010-WA5-Paper3
IMAPSource Conference Papers
Vignes, Justin, Fred Haring, Syed Sajid Ahmad, Kaycie Gerstner, and Aaron Reinholz. 2010. “Laser Patterning and Via Drilling of Sapphire Wafers and Die.”
IMAPSource Proceedings
2010 (1): 513–20.
https://doi.org/10.4071/isom-2010-WA5-Paper3
.
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