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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications
James McLeish
,
Randy Schueller
,
Cu Wire Bonds
Automotive
Reliability
•
https://doi.org/10.4071/isom-2015-Poster8
IMAPSource Conference Papers
McLeish, James, and Randy Schueller. 2015. “Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications.”
IMAPSource Proceedings
2015 (1): 751–56.
https://doi.org/10.4071/isom-2015-Poster8
.
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