Vol. 2015, Issue 1, 2015October 01, 2015 EDT
FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules
FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules
Kroehnert, Steffen, José Campos, André Cardoso, Eoin O’Toole, Abel Janeiro, and Nuno Vieira. 2015. “FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules.” IMAPSource Proceedings 2015 (1): 239–44. https://doi.org/10.4071/isom-2015-WA32.