Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules
Steffen Kroehnert
,
José Campos
,
André Cardoso
,
Eoin O'Toole
,
Abel Janeiro
,
Nuno Vieira
,
Electromagnetic and thermal package performance
FOWLP
eWLB technology
miniaturization
packaging for IoT/IoE
dense system integration
WLFO
WLSiP
WL3D
WLPoP
sensor packaging
KOZ
•
https://doi.org/10.4071/isom-2015-WA32
IMAPSource Conference Papers
Kroehnert, Steffen, José Campos, André Cardoso, Eoin O’Toole, Abel Janeiro, and Nuno Vieira. 2015. “FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules.”
IMAPSource Proceedings
2015 (1): 239–44.
https://doi.org/10.4071/isom-2015-WA32
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats