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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

Steffen Kroehnert, José Campos, André Cardoso, Eoin O'Toole, Abel Janeiro, Nuno Vieira,
Electromagnetic and thermal package performanceFOWLPeWLB technologyminiaturizationpackaging for IoT/IoEdense system integrationWLFOWLSiPWL3DWLPoPsensor packagingKOZ
https://doi.org/10.4071/isom-2015-WA32
IMAPSource Conference Papers
Kroehnert, Steffen, José Campos, André Cardoso, Eoin O’Toole, Abel Janeiro, and Nuno Vieira. 2015. “FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules.” IMAPSource Proceedings 2015 (1): 239–44. https:/​/​doi.org/​10.4071/​isom-2015-WA32.
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