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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package
Priyal Shah
,
Milind Bhagavat
,
Finite element method
flip-chip package
lid design
semiconductor package assembly process
stiffener ring
warpage reduction
•
https://doi.org/10.4071/2380-4505-2019.1.000110
IMAPSource Conference Papers
Shah, Priyal, and Milind Bhagavat. 2019. “Optimal Lid Design Parameters for Reducing Warpage of Flip-Chip Package.”
IMAPSource Proceedings
2019 (1): 110–14.
https://doi.org/10.4071/2380-4505-2019.1.000110
.
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