Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package
Shah, Priyal, and Milind Bhagavat. 2019. “Optimal Lid Design Parameters for Reducing Warpage of Flip-Chip Package.” IMAPSource Proceedings 2019 (1): 110–14. https://doi.org/10.4071/2380-4505-2019.1.000110.
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