Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package

Shah, Priyal, and Milind Bhagavat. 2019. “Optimal Lid Design Parameters for Reducing Warpage of Flip-Chip Package.” IMAPSource Proceedings 2019 (1): 110–14. https://doi.org/10.4071/2380-4505-2019.1.000110.