Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates
Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates
Gorywoda, Marek, Rainer Dohle, Bernd Kandler, and Bernd Burger. 2015. “Study on Electromigration in Flip Chip Lead-Free Solder Connections with 40 Μm or 30 Μm Diameter on Thin Film Ceramic Substrates.” IMAPSource Proceedings 2015 (1): 799–805. https://doi.org/10.4071/isom-2015-THP25.
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