Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates

Gorywoda, Marek, Rainer Dohle, Bernd Kandler, and Bernd Burger. 2015. “Study on Electromigration in Flip Chip Lead-Free Solder Connections with 40 Μm or 30 Μm Diameter on Thin Film Ceramic Substrates.” IMAPSource Proceedings 2015 (1): 799–805. https:/​/​doi.org/​10.4071/​isom-2015-THP25.