Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Investigation of the Direct Plating Copper (DPC) on Al2O3, BeO or AlN Ceramic Substrates for High Power Density Applications
Investigation of the Direct Plating Copper (DPC) on Al2O3, BeO or AlN Ceramic Substrates for High Power Density Applications
Yu, Ho-Chieh (Jay), and Jason Huang. 2016. “Investigation of the Direct Plating Copper (DPC) on Al2O3, BeO or AlN Ceramic Substrates for High Power Density Applications.” IMAPSource Proceedings 2016 (1): 79–86. https://doi.org/10.4071/isom-2016-TP43.
Powered by Scholastica, the modern academic journal management system