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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology

R.K. Trichur, M. Fowler, J.W. McCutcheon, M. Daily,
Planarizing Deep Trenches Polymeric Material Through-Silicon Via TSV 3D
• https://doi.org/10.4071/isom-2010-TP1-Paper6
IMAPSource Conference Papers
Trichur, R.K., M. Fowler, J.W. McCutcheon, and M. Daily. 2010. “Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology.” IMAPSource Proceedings 2010 (1): 192–96. https://doi.org/10.4071/isom-2010-TP1-Paper6.
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