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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology
R.K. Trichur
,
M. Fowler
,
J.W. McCutcheon
,
M. Daily
,
Planarizing
Deep Trenches
Polymeric Material
Through-Silicon Via
TSV
3D
•
https://doi.org/10.4071/isom-2010-TP1-Paper6
IMAPSource Conference Papers
Trichur, R.K., M. Fowler, J.W. McCutcheon, and M. Daily. 2010. “Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology.”
IMAPSource Proceedings
2010 (1): 192–96.
https://doi.org/10.4071/isom-2010-TP1-Paper6
.
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