Vol. 2011, Issue 1, 2011January 01, 2011 EDT
High temperature Au-based solder reliability in electronic packages for harsh environments
High temperature Au-based solder reliability in electronic packages for harsh environments
Sousa, M.F., S. Riches, C. Johnston, and P.S. Grant. 2011. “High Temperature Au-Based Solder Reliability in Electronic Packages for Harsh Environments.” IMAPSource Proceedings 2011 (1): 438–45. https://doi.org/10.4071/isom-2011-TP6-Paper6.