Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive Application

Tu Anh Tran; Varughese Mathew; Wen Shi Koh; K. Y. Yow; Y. K. Au

doi:10.4071/isom-2013-WP24

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Tran, Tu Anh, Varughese Mathew, Wen Shi Koh, K. Y. Yow, and Y. K. Au. 2013. “Dicing Development for Low-k Copper Wafers Using Nickel-Palladium-Gold Bond Pads for Automotive Application.” IMAPSource Proceedings 2013 (1): 657–62. https://doi.org/10.4071/isom-2013-WP24.

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