Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power Module
Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power Module
Saxena, Kuldeep, Aryn Hays, Ivan Kao, and Zach Cole. 2018. “Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power Module.” IMAPSource Proceedings 2018 (1): 549–55. https://doi.org/10.4071/2380-4505-2018.1.000549.