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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt
Randy Hamm
,
Ken Peterson
,
Au-Sn
die-attach
void-free
CSAM
•
https://doi.org/10.4071/isom-2015-THP43
IMAPSource Conference Papers
Hamm, Randy, and Ken Peterson. 2015. “Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt.”
IMAPSource Proceedings
2015 (1): 848–55.
https://doi.org/10.4071/isom-2015-THP43
.
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