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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Randy Hamm, Ken Peterson,
Au-Sndie-attachvoid-freeCSAM
https://doi.org/10.4071/isom-2015-THP43
IMAPSource Conference Papers
Hamm, Randy, and Ken Peterson. 2015. “Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt.” IMAPSource Proceedings 2015 (1): 848–55. https:/​/​doi.org/​10.4071/​isom-2015-THP43.
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