ISSN 2380-4505
Vol. 2015, Issue 1, 2015October 01, 2015 EDT
I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-test Analysis Techniques and Results
I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-test Analysis Techniques and Results
Torok, John, Shawn Canfield, Suraush Khambati, Robert Mullady, Budy Notohardjono, and Jing Zhang. 2015. “I/O Printed Circuit Board Assemblies; Recent Learning in Mechanical Stress Analysis, Verification Testing, and Post-Test Analysis Techniques and Results.” IMAPSource Proceedings 2015 (1): 169–78. https://doi.org/10.4071/isom-2015-TP64.