Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology

Chan, Mu-Hsuan, Yu-Po Wang, Ivan Chang, James Chiang, George Pan, Nicholas Kao, and David Wang. 2016. “Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology.” IMAPSource Proceedings 2016 (1): 524–28. https:/​/​doi.org/​10.4071/​isom-2016-Poster4.