Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology

Mu-Hsuan Chan; Yu-Po Wang; Ivan Chang; James Chiang; George Pan; Nicholas Kao; David Wang

doi:10.4071/isom-2016-Poster4

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Chan, Mu-Hsuan, Yu-Po Wang, Ivan Chang, James Chiang, George Pan, Nicholas Kao, and David Wang. 2016. “Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology.” IMAPSource Proceedings 2016 (1): 524–28. https://doi.org/10.4071/isom-2016-Poster4.

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