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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology

Mu-Hsuan Chan, Yu-Po Wang, Ivan Chang, James Chiang, George Pan, Nicholas Kao, David Wang,
Fan-out Warpage Wafer-level package
• https://doi.org/10.4071/isom-2016-Poster4
IMAPSource Conference Papers
Chan, Mu-Hsuan, Yu-Po Wang, Ivan Chang, James Chiang, George Pan, Nicholas Kao, and David Wang. 2016. “Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology.” IMAPSource Proceedings 2016 (1): 524–28. https://doi.org/10.4071/isom-2016-Poster4.
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