L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application

Yu-Hua Chen; Shyh-Lian Cheng; Dyi-Chung Hu; Tzvy-Jang Tseng

doi:10.4071/isom-2015-THP53

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Chen, Yu-Hua, Shyh-Lian Cheng, Dyi-Chung Hu, and Tzvy-Jang Tseng. 2015. “L/S ≤ 5/5μm Line Embedded Organic Substrate Manufacturing for 2.1D/2.5D SiP Application.” IMAPSource Proceedings 2015 (1): 874–78. https://doi.org/10.4071/isom-2015-THP53.

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