ISSN 2380-4505
Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics Components
Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics Components
Hertl, Michael. 2011. “Topography and Deformation Measurement as a New Tool for Thermal Stress Assessment on Electronics Components.” IMAPSource Proceedings 2011 (1): 400–408. https://doi.org/10.4071/isom-2011-TP6-Paper2.