Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive Application

Tran, Tu Anh, Varughese Mathew, Wen Shi Koh, K. Y. Yow, and Y. K. Au. 2012. “Dicing Development for Low-k Copper Wafers Using Nickel-Palladium-Gold Bond Pads for Automotive Application.” IMAPSource Proceedings 2012 (1): 1085–96. https:/​/​doi.org/​10.4071/​isom-2012-THP31.