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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive Application

Tu Anh Tran, Varughese Mathew, Wen Shi Koh, K. Y. Yow, Y. K. Au,
electroless Ni/Pd/Au automotive reliability dicing sidewall cracking
• https://doi.org/10.4071/isom-2012-THP31
IMAPSource Conference Papers
Tran, Tu Anh, Varughese Mathew, Wen Shi Koh, K. Y. Yow, and Y. K. Au. 2012. “Dicing Development for Low-k Copper Wafers Using Nickel-Palladium-Gold Bond Pads for Automotive Application.” IMAPSource Proceedings 2012 (1): 1085–96. https://doi.org/10.4071/isom-2012-THP31.
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