Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive Application

Tu Anh Tran; Varughese Mathew; Wen Shi Koh; K. Y. Yow; Y. K. Au

doi:10.4071/isom-2012-THP31

Loading [Contrib]/a11y/accessibility-menu.js

Tran, Tu Anh, Varughese Mathew, Wen Shi Koh, K. Y. Yow, and Y. K. Au. 2012. “Dicing Development for Low-k Copper Wafers Using Nickel-Palladium-Gold Bond Pads for Automotive Application.” IMAPSource Proceedings 2012 (1): 1085–96. https://doi.org/10.4071/isom-2012-THP31.

View more stats