Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages
Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages
Denoyo, Alvin, Darwin De Lazo, Ivan Costa, and Allen Menor. 2019. “Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages.” IMAPSource Proceedings 2019 (1): 91–94. https://doi.org/10.4071/2380-4505-2019.1.000091.