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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
3D Packages and Assembly Methodologies
Bernd K Appelt
,
3D stacking
package on package
silicon interposer
•
https://doi.org/10.4071/isom-2011-THA6-Paper2
IMAPSource Conference Papers
Appelt, Bernd K. 2011. “3D Packages and Assembly Methodologies.”
IMAPSource Proceedings
2011 (1): 1074–78.
https://doi.org/10.4071/isom-2011-THA6-Paper2
.
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