Mold Compound Adhesion Reliability with SiN and SiON Passivation

Varughese Mathew; Sheila Chopin; Trent Uehling; Ruzaini Ibrahim

doi:10.4071/isom-2011-WP2-Paper6

Mathew, Varughese, Sheila Chopin, Trent Uehling, and Ruzaini Ibrahim. 2011. “Mold Compound Adhesion Reliability with SiN and SiON Passivation.” IMAPSource Proceedings 2011 (1): 729–34. https://doi.org/10.4071/isom-2011-WP2-Paper6.

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