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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Fine pitch Copper Pillar interconnection with C4 (Mass Reflow) Processing
Fernando Roa
,
Flip chip
underfill
molded package
copper pillar
mass reflow
thermo compression
•
https://doi.org/10.4071/isom-TA42
IMAPSource Conference Papers
Roa, Fernando. 2014. “Fine Pitch Copper Pillar Interconnection with C4 (Mass Reflow) Processing.”
IMAPSource Proceedings
2014 (1): 107–11.
https://doi.org/10.4071/isom-TA42
.
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