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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Fine pitch Copper Pillar interconnection with C4 (Mass Reflow) Processing

Fernando Roa,
Flip chip underfill molded package copper pillar mass reflow thermo compression
• https://doi.org/10.4071/isom-TA42
IMAPSource Conference Papers
Roa, Fernando. 2014. “Fine Pitch Copper Pillar Interconnection with C4 (Mass Reflow) Processing.” IMAPSource Proceedings 2014 (1): 107–11. https://doi.org/10.4071/isom-TA42.
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