Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

Xiangdong Liu; Hiroshi Nishikawa

doi:10.4071/isom-2015-WP43

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Liu, Xiangdong, and Hiroshi Nishikawa. 2015. “Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging.” IMAPSource Proceedings 2015 (1): 449–52. https://doi.org/10.4071/isom-2015-WP43.

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