Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging
Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging
Liu, Xiangdong, and Hiroshi Nishikawa. 2015. “Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging.” IMAPSource Proceedings 2015 (1): 449–52. https://doi.org/10.4071/isom-2015-WP43.