Process challenges in 0-level packaging using 100μm-thin chip capping with TSV

Pham, Nga P., Vladimir Cherman, Nina Tutunjyan, Lieve Teugels, Deniz S. Tezcan, and Harrie A.C. Tilmans. 2012. “Process Challenges in 0-Level Packaging Using 100μm-Thin Chip Capping with TSV.” IMAPSource Proceedings 2012 (1): 276–82. https://doi.org/10.4071/isom-2012-TP17.