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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer

Venky Sundaram, Jialing Tong, Kaya Demir, Timothy Huang, Aric Shorey, Scott Pollard, Rao Tummala,
TPVs (Through-Package-Vias)glass interposerreliabilityelectrical performance
https://doi.org/10.4071/isom-WA16
IMAPSource Conference Papers
Sundaram, Venky, Jialing Tong, Kaya Demir, Timothy Huang, Aric Shorey, Scott Pollard, and Rao Tummala. 2014. “High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer.” IMAPSource Proceedings 2014 (1): 402–8. https:/​/​doi.org/​10.4071/​isom-WA16.
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