High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer

Venky Sundaram; Jialing Tong; Kaya Demir; Timothy Huang; Aric Shorey; Scott Pollard; Rao Tummala

doi:10.4071/isom-WA16

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Sundaram, Venky, Jialing Tong, Kaya Demir, Timothy Huang, Aric Shorey, Scott Pollard, and Rao Tummala. 2014. “High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer.” IMAPSource Proceedings 2014 (1): 402–8. https://doi.org/10.4071/isom-WA16.

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