Vol. 2014, Issue 1, 2014January 01, 2014 EDT
High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer
High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer
Sundaram, Venky, Jialing Tong, Kaya Demir, Timothy Huang, Aric Shorey, Scott Pollard, and Rao Tummala. 2014. “High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer.” IMAPSource Proceedings 2014 (1): 402–8. https://doi.org/10.4071/isom-WA16.